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Freescale Semiconductor Technical Data
Document Number: MMG3008NT1 Rev. 1, 8/2005
Heterojunction Bipolar Transistor (InGaP HBT)
Broadband High Linearity Amplifier
The MMG3008NT1 is a General Purpose Amplifier that is internally input and output matched. It is designed for a broad range of Class A, small - signal, high linearity, general purpose applications. It is suitable for applications with frequencies from 0 to 6000 MHz such as Cellular, P C S , B WA , W L L , P H S , C AT V, V H F, U H F, U M T S a n d g e n e r a l small-signal RF. Features * Frequency: 0 to 6000 MHz * P1dB: 15 dBm @ 900 MHz * Small-Signal Gain: 18.5 dB @ 900 MHz * Third Order Output Intercept Point: 26 dBm @ 900 MHz * Single 5 Volt Supply * Internally Matched to 50 Ohms * Low Cost SOT -89 Surface Mount Package * Pb -Free and RoHS Compliant * In Tape and Reel. T1 Suffix = 1000 Units per 12 mm, 7 inch Reel.
MMG3008NT1
0 -6000 MHz, 18.5 dB 15 dBm InGaP HBT
12
3
CASE 1514-01, STYLE 1 SOT-89 PLASTIC
Table 1. Typical Performance (1)
Characteristic Small-Signal Gain (S21) Input Return Loss (S11) Output Return Loss (S22) Power Output @1dB Compression Third Order Output Intercept Point Symbol Gp IRL ORL P1db IP3 900 MHz 18.5 -18 -20 15 26 2140 MHz 16 -22 -18 14 25.5 3500 MHz 13 -20 -16 14 25 Unit dB dB dB dBm dBm
Table 2. Maximum Ratings
Rating Supply Voltage (2) Supply Current
(2)
Symbol VCC ICC Pin Tstg TJ
Value 6 80 10 -65 to +150 150
Unit V mA dBm C C
RF Input Power Storage Temperature Range Junction Temperature (3)
2. Continuous voltage and current applied to device. 3. For reliable operation, the junction temperature should not exceed 150C.
1. VCC = 5 Vdc, TC = 25C, 50 ohm system
Table 3. Thermal Characteristics (VCC = 5 Vdc, ICC = 38 mA, TC = 25C)
Characteristic Thermal Resistance, Junction to Case Symbol RJC Value (4) 84 Unit C/W
4. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf. Select Documentation/Application Notes - AN1955.
Freescale Semiconductor, Inc., 2005. All rights reserved.
MMG3008NT1 1
RF Device Data Freescale Semiconductor
Table 4. Electrical Characteristics (VCC = 5 Vdc, 900 MHz, TC = 25C, 50 ohm system, in Freescale Application Circuit)
Characteristic Small-Signal Gain (S21) Input Return Loss (S11) Output Return Loss (S22) Power Output @ 1dB Compression Third Order Output Intercept Point Noise Figure Supply Current (1) Supply Voltage (1) 1. For reliable operation, the junction temperature should not exceed 150C. Symbol Gp IRL ORL P1dB IP3 NF ICC VCC Min 17 -- -- -- -- -- 32 -- Typ 18.5 -18 -20 15 26 4 38 5 Max -- -- -- -- -- -- 48 -- Unit dB dB dB dBm dBm dB mA V
MMG3008NT1 2 RF Device Data Freescale Semiconductor
Table 5. Functional Pin Description
Pin Number 1 2 3 RFin Ground RFout/DC Supply 1 2 3 Pin Function 2
Figure 1. Functional Diagram
Table 6. ESD Protection Characteristics
Test Methodology Human Body Model (per JESD 22-A114) Machine Model (per EIA/JESD 22-A115) Charge Device Model (per JESD 22-C101) Class 1A (Minimum) A (Minimum) IV (Minimum)
Table 7. Moisture Sensitivity Level
Test Methodology Per JESD 22-A113, IPC/JEDEC J-STD-020 Rating 1 Package Peak Temperature 260 Unit C
MMG3008NT1 RF Device Data Freescale Semiconductor 3
50 OHM TYPICAL CHARACTERISTICS
25 Gp, SMALL-SIGNAL GAIN (dB) 0
TC = 85C 20 -40C 15
25C S11, S22 (dB)
-10 S22 -20
-30 VCC = 5 Vdc 10 0 1 2 f, FREQUENCY (GHz) 3 4 -40 0
S11 VCC = 5 Vdc ICC = 38 mA 1 2 f, FREQUENCY (GHz) 3 4
Figure 2. Small -Signal Gain (S21) versus Frequency
Figure 3. Input/Output Return Loss versus Frequency
23 P1dB, 1 dB COMPRESSION POINT (dBm) 21 Gp, SMALL-SIGNAL GAIN (dB) 19 17 15 2600 MHz 13 3500 MHz 11 9 7 8 9 10 11 12 VCC = 5 Vdc ICC = 38 mA 13 14 15 900 MHz 1960 MHz 2140 MHz
17 16 15 14 13 12 11 10 0.5 1 1.5 2 2.5 3 3.5 f, FREQUENCY (GHz) VCC = 5 Vdc ICC = 38 mA
Pout, OUTPUT POWER (dBm)
Figure 4. Small -Signal Gain versus Output Power
IP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) 80 ICC, COLLECTOR CURRENT (mA) 70 60 50 40 30 20 10 0 4 4.2 4.4 4.6 4.8 5 5.2 5.4 VCC, COLLECTOR VOLTAGE (V) 30
Figure 5. P1dB versus Frequency
27
24
21 VCC = 5 Vdc ICC = 38 mA 1 MHz Tone Spacing 0 1 2 f, FREQUENCY (GHz) 3 4
18
15
Figure 6. Collector Current versus Collector Voltage
Figure 7. Third Order Output Intercept Point versus Frequency
MMG3008NT1 4 RF Device Data Freescale Semiconductor
50 OHM TYPICAL CHARACTERISTICS
IP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) 33 IP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) 29 28 27 26 25 24 23 22 -40 VCC = 5 Vdc f = 900 MHz 1 MHz Tone Spacing -20 0 20 40 60 80 100
30
27
24
21 f = 900 MHz 1 MHz Tone Spacing 18 4.9 4.95 5 5.05 5.1 VCC, COLLECTOR VOLTAGE (V)
T, TEMPERATURE (_C)
Figure 8. Third Order Output Intercept Point versus Collector Voltage
Figure 9. Third Order Output Intercept Point versus Case Temperature
-30 IMD, THIRD ORDER INTERMODULATION DISTORTION (dBc)
105
-40 MTTF (YEARS) VCC = 5 Vdc ICC = 38 mA f = 900 MHz 1 MHz Tone Spacing 103 -3 0 3 6 9 12 120 125 130 135 140 145 150 Pout, OUTPUT POWER (dBm) TJ, JUNCTION TEMPERATURE (C) NOTE: The MTTF is calculated with VCC = 5 Vdc, ICC = 38 mA
-50
104
-60
-70
-80 -6
Figure 10. Third Order Intermodulation versus Output Power
Figure 11. MTTF versus Junction Temperature
ACPR, ADJACENT CHANNEL POWER RATIO (dB)
8
-20 VCC = 5 Vdc, ICC = 38 mA, f = 2140 MHz Single-Carrier W-CDMA, 3.84 MHz Channel Bandwidth PAR = 8.5 dB @ 0.01% Probability (CCDF)
NF, NOISE FIGURE (dB)
6
-30
-40
4
-50
2 VCC = 5 Vdc ICC = 38 mA 0 0 1 2 f, FREQUENCY (GHz) 3 4
-60
-70 -3 0 3 6 9 12 Pout, OUTPUT POWER (dBm)
Figure 12. Noise Figure versus Frequency
Figure 13. Single -Carrier W-CDMA Adjacent Channel Power Ratio versus Output Power MMG3008NT1
RF Device Data Freescale Semiconductor
5
50 OHM APPLICATION CIRCUIT: 40-300 MHz
VSUPPLY
R1
C3 L1 RF INPUT DUT
C4
Z1 C1
Z2
Z3
Z4 C2 Z4 PCB
Z5
RF OUTPUT
VCC
Z1, Z5 Z2 Z3
0.347 x 0.058 Microstrip 0.575 x 0.058 Microstrip 0.172 x 0.058 Microstrip
0.403 x 0.058 Microstrip Getek Grade ML200C, 0.031, r = 4.1
Figure 14. 50 Ohm Test Circuit Schematic
30 20 10 0 -10 -20 -30 -40 0 100 200 300 400 500 f, FREQUENCY (MHz) VCC = 5 Vdc ICC = 38 mA S11 MMG30XX Rev 2 S22 C1 C4 C3 L1 C2 S21 R1 S21, S11, S22 (dB)
Figure 15. S21, S11 and S22 versus Frequency
Figure 16. 50 Ohm Test Circuit Component Layout
Table 8. 50 Ohm Test Circuit Component Designations and Values
Part C1, C2, C3 C4 L1 R1 Description 0.01 F Chip Capacitors 1000 pF Chip Capacitor 470 nH Chip Inductor 0 W Chip Resistor Part Number 0603A103JAT2A 0603A102JAT2A BK2125HM471 ERJ3GEY0R00V Manufacturer AVX AVX Taiyo Yuden Panasonic
MMG3008NT1 6 RF Device Data Freescale Semiconductor
50 OHM APPLICATION CIRCUIT: 300-3600 MHz
VSUPPLY
R1
C3 L1 RF INPUT DUT
C4
Z1 C1
Z2
Z3
Z4 C2 Z4 PCB
Z5
RF OUTPUT
VCC
Z1, Z5 Z2 Z3
0.347 x 0.058 Microstrip 0.575 x 0.058 Microstrip 0.172 x 0.058 Microstrip
0.403 x 0.058 Microstrip Getek Grade ML200C, 0.031, r = 4.1
Figure 17. 50 Ohm Test Circuit Schematic
30 20 S21, S11, S22 (dB) 10 0 C1 -10 -20 -30 300 S11 S22 800 1300 1800 2300 2800 3300 3800 MMG30XX Rev 2 L1 C2 S21 VCC = 5 Vdc ICC = 38 mA R1 C4 C3
f, FREQUENCY (MHz)
Figure 18. S21, S11 and S22 versus Frequency
Figure 19. 50 Ohm Test Circuit Component Layout
Table 9. 50 Ohm Test Circuit Component Designations and Values
Part C1, C2 C3 C4 L1 R1 Description 150 pF Chip Capacitors 0.01 F Chip Capacitor 1000 pF Chip Capacitor 56 nH Chip Inductor 0 W Chip Resistor Part Number 06035A151JAT2A 0603A103JAT2A 0603A102JAT2A HK160856NJ-T ERJ3GEY0R00V Manufacturer AVX AVX AVX Taiyo Yuden Panasonic
MMG3008NT1 RF Device Data Freescale Semiconductor 7
50 OHM TYPICAL CHARACTERISTICS
Table 10. Class A Common Emitter S -Parameters at VCC = 5 Vdc, ICC = 38 mA, TC = 255C
f GHz 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7 0.75 0.8 0.85 0.9 0.95 1 1.05 1.1 1.15 1.2 1.25 1.3 1.35 1.4 1.45 1.5 1.55 1.6 1.65 1.7 1.75 1.8 1.85 1.9 1.95 2 2.05 2.1 2.15 2.2 2.25 2.3 2.35 S11 |S11| 0.03723 0.03824 0.03924 0.03984 0.04044 0.04154 0.04218 0.04330 0.04391 0.04504 0.04579 0.04639 0.04725 0.04874 0.05044 0.05265 0.05446 0.05671 0.05987 0.06338 0.06818 0.07156 0.07622 0.08148 0.08625 0.08847 0.09042 0.09247 0.09461 0.09681 0.09928 0.10270 0.10530 0.10836 0.11174 0.11560 0.11980 0.12349 0.12873 0.13268 0.13725 0.14017 0.14638 0.15016 0.15521 0.15976 -157.139 -159.784 -161.141 -163.743 -165.433 -167.556 -169.996 -171.505 -173.121 -175.107 -177.279 -179.085 178.481 176.513 174.578 172.441 170.794 168.866 166.015 164.827 162.719 160.419 158.869 156.417 154.855 152.545 150.239 148.043 146.969 144.023 141.737 139.246 137.14 134.919 132.496 130.26 128.189 126.377 124.287 121.985 120.2 118.487 116.403 114.638 112.618 110.76 |S21| 9.53422 9.45692 9.38250 9.30193 9.23472 9.16107 9.08796 9.01503 8.93887 8.86645 8.79137 8.72227 8.65074 8.57600 8.49615 8.41904 8.33301 8.24325 8.16300 8.06445 7.97785 7.88628 7.79192 7.70036 7.61312 7.52137 7.43401 7.33853 7.25672 7.16705 7.08702 6.98699 6.90998 6.82646 6.74375 6.65836 6.57651 6.49376 6.41028 6.33373 6.25726 6.18534 6.10210 6.02971 5.95603 5.88332 S21 174.957 172.557 169.351 166.775 164.195 161.651 159.059 156.523 153.864 151.441 148.941 146.469 144.076 141.652 139.244 136.846 134.487 132.225 129.928 127.713 125.419 123.146 120.927 118.767 116.644 114.548 112.485 110.413 108.381 106.399 104.396 102.42 100.459 98.556 96.678 94.774 92.937 91.045 89.21 87.389 85.623 83.864 82.117 80.32 78.605 76.922 |S12| 0.07125 0.07151 0.07173 0.07196 0.07227 0.07249 0.07267 0.07303 0.07333 0.07360 0.07384 0.07422 0.07453 0.07485 0.07535 0.07573 0.07615 0.07660 0.07706 0.07745 0.07782 0.07832 0.07888 0.07940 0.07998 0.08040 0.08082 0.08128 0.08193 0.08243 0.08305 0.08347 0.08398 0.08445 0.08491 0.08539 0.08590 0.08640 0.08693 0.08742 0.08786 0.08852 0.08869 0.08941 0.08986 0.09022 S12 -0.244 -0.321 -0.527 -0.705 -0.968 -1.121 -1.321 -1.54 -1.729 -1.953 -2.108 -2.436 -2.667 -2.877 -3.216 -3.535 -3.858 -4.215 -4.628 -5.024 -5.308 -5.91 -6.277 -6.79 -7.245 -7.843 -8.299 -8.836 -9.303 -9.992 -10.464 -11.112 -11.668 -12.336 -12.894 -13.604 -14.2 -14.843 -15.588 -16.17 -16.886 -17.695 -18.285 -19.001 -19.642 -20.411 |S22| 0.15383 0.15195 0.15038 0.14855 0.14665 0.14473 0.14297 0.14282 0.14257 0.14246 0.14236 0.14207 0.14191 0.14153 0.13860 0.13706 0.13387 0.13169 0.12795 0.12512 0.12243 0.11969 0.11711 0.11465 0.11217 0.10841 0.10615 0.10380 0.10158 0.10048 0.09950 0.09874 0.09873 0.09872 0.09935 0.09998 0.10150 0.10335 0.10540 0.10798 0.11081 0.11466 0.11714 0.12062 0.12414 0.12774 S22 -9.473 -11.4 -15.453 -20.132 -25.238 -29.059 -33.099 -37.115 -40.95 -45.011 -48.838 -52.786 -56.644 -60.456 -64.47 -68.268 -72.153 -76.394 -80.615 -84.753 -89.314 -94.022 -98.985 -104.195 -109.672 -114.968 -120.795 -126.657 -128.442 -133.06 -138.358 -142.307 -147.8 -152.853 -157.527 -162.646 -167.628 -172.451 -176.909 178.048 174.074 169.543 166.109 161.975 158.434 155.044
MMG3008NT1 8 RF Device Data Freescale Semiconductor
50 OHM TYPICAL CHARACTERISTICS
Table 10. Class A Common Emitter S -Parameters at VCC = 5 Vdc, ICC = 38 mA, TC = 255C (continued)
f GHz 2.4 2.45 2.5 2.55 2.6 2.65 2.7 2.75 2.8 2.85 2.9 2.95 3 3.05 3.1 3.15 3.2 3.25 3.3 3.35 3.4 3.45 3.5 3.55 3.6 S11 |S11| 0.16414 0.16931 0.17290 0.17697 0.18119 0.18491 0.18871 0.19276 0.19700 0.20042 0.20441 0.20776 0.21089 0.21615 0.21938 0.22294 0.22712 0.23123 0.23510 0.23920 0.24357 0.24799 0.25252 0.25708 0.26176 109.067 107.269 105.625 103.866 102.097 100.467 98.781 97.217 95.483 93.791 92.231 90.583 89.007 87.21 85.618 84.139 82.548 80.985 79.448 77.951 76.439 75.054 73.636 72.232 70.859 |S21| 5.81205 5.74220 5.67374 5.60911 5.54039 5.48069 5.41580 5.35397 5.29285 5.23322 5.17959 5.11646 5.06803 5.01467 4.95573 4.90100 4.85380 4.80281 4.75341 4.70392 4.65357 4.60593 4.55940 4.51351 4.46687 S21 75.215 73.556 71.895 70.217 68.601 66.985 65.359 63.725 62.113 60.504 58.977 57.358 55.76 54.217 52.66 51.117 49.552 47.99 46.438 44.903 43.375 41.828 40.312 38.767 37.242 |S12| 0.09063 0.09110 0.09160 0.09197 0.09243 0.09288 0.09335 0.09367 0.09412 0.09452 0.09485 0.09546 0.09593 0.09605 0.09660 0.09698 0.09728 0.09759 0.09808 0.09840 0.09872 0.09894 0.09929 0.09959 0.09973 S12 -21.132 -21.914 -22.568 -23.366 -24.135 -24.891 -25.672 -26.386 -27.158 -28.071 -28.821 -29.704 -30.551 -31.388 -32.161 -33.041 -33.934 -34.778 -35.752 -36.597 -37.435 -38.395 -39.286 -40.173 -41.064 |S22| 0.13152 0.13622 0.13975 0.14370 0.14796 0.15201 0.15562 0.16040 0.16438 0.16843 0.17329 0.17724 0.18220 0.18674 0.19068 0.19574 0.20063 0.20541 0.21019 0.21526 0.22065 0.22551 0.23111 0.23653 0.24174 S22 151.453 148.114 145.204 142.104 139.028 136.155 133.387 130.458 127.735 124.907 122.375 119.612 116.735 114.476 111.831 109.296 106.823 104.361 101.936 99.673 97.38 95.15 92.952 90.83 88.712
MMG3008NT1 RF Device Data Freescale Semiconductor 9
1.7 7.62 0.305 diameter
3.48 5.33 1.27 1.27 0.86 0.64 3.86 0.58
2.49
2.54
Recommended Solder Stencil
NOTES: 1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE USED IN PCB LAYOUT DESIGN. 2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN. 3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL AND RF PERFORMANCE. 4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM PITCH.
Figure 20. Recommended Mounting Configuration
MMG3008NT1 10 RF Device Data Freescale Semiconductor
PACKAGE DIMENSIONS
3 A 4
4.70 4.40 1.87 1.79
0.15 M C A B
B
0.60 0.40
2X R0.15 TYP 1.70 1.40
3
4
2.70 2.40
4.50 3.70
2X 4 TYP
1.30 0.70
5 0.48 0.38
1
2
3
2X
0.20 M C B
0.48 0.38 0.58 0.48
0.15 M C A B
0.15 M C A B
0.15 M C A B
0.46 0.40
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.5MM PER END. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.5MM PER SIDE. 4. DIMENSIONS ARE DETERMINED AT THE OUTMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
2X 4 TYP
E.P. 2X R0.20
4X 0.10 C
SEATING PLANE 1.50 1.50 1.65 1.55
STYLE 1: PIN 1. RF INPUT 2. GROUND 3. RF OUTPUT
0.65 0.55
1.35 1.25
C
CASE 1514-01 ISSUE C SOT -89 PLASTIC
BOTTOM VIEW
MMG3008NT1 RF Device Data Freescale Semiconductor 11
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MMG3008NT1
Rev. 12 1, 8/2005 Document Number: MMG3008NT1
RF Device Data Freescale Semiconductor

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